This paper investigates the performance of bundles of Single Wall Carbon Nanotubes (SWCNT) for low-power and high-speed interconnects for future VLSI applications. The power dissipation and delay of SWCNT bundle interconnects are examined and compared with that of the Cu interconnects at different technology (16nm, 22nm, 32nm & 45nm) nodes for both intermediate and global interconnects. The results show that SWCNTs bundle have better power handling capacity and are also faster than Cu for intermediate and global interconnects. It is concluded that Metallic SWCNT are a viable candidate for intermediate and global interconnects in future technologies.
September 29, 2015
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